Thursday, 8 October 2026 | 14:00 - 18:00
Mikrointegration und Advanced Packaging
- Microintegration
- AI
- Advanced Packaging
Chair: Dr. Adrian Mahlkow (OpTecBB e.V.)
Microintegration and Advanced Packaging have been on everyone’s lips, particularly since the growing demand for bandwidth and power consumption in the latest generations of chips. Photonics can offer solutions to the challenges facing the next generations of data centres. In this session, we will provide an insight into the latest developments in this field.
Agenda:
14:00 - 14:35 "Semicon goes Photonics - latest Trends and forecast", Dr. Adrian Mahlkow (OpTecBB)
14:35 - 15:00 "Hybrid Photonics Integration", David De Felipe Mesquida (Fraunhofer HHI)
15:00 - 15:25 "Must DeepTech be HighTech?, How to create disruptive innovation with seemingly simple technology. Real-world examples from a serial inventor.", Oliver Völckers (BeST Berliner Sensortechnik GmbH)
15:25 - 15:50 "Stepper-Based Desktop Solutions for Active & Passive Photonic Alignment and Assembly", Thorben Windeler & Achim Weber (GMT Europe GmbH)
15:50 - 16:25 Coffee break
16:25 - 16:50 "Glass panel integration", Philipp Wachholz (Eyonex Glass)
16:50 - 17:15 "Micro-Integrated Laser Module Sources for Ophthalmic Applications" Nils Werner (FBH)
17:15 - 17:30 Wrap-up
7 speakers
CEO
OpTecBB e.V.
Deputy head of research group Hybrid PICs
Fraunhofer Heinrich Hertz Institut
Product Manager
GMT Europe GmbH
CEO
BeST Berliner Sensortechnik GmbH
General Manager
GMT Europe GmbH
CEO
Eyonex Glass Technologies
Director Laser Development
EPIGAP OSA Photonics GmbH
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